Recent Articles
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IBM Chip to Challenge UWB
IBM researchers said Feb. 6 that they have created a low-power chip set that will compete with Ultra-Wideband technology, offering data rates at around 630M bps. The chip set conforms to the IEEE 802.15.3c specification, which IBM refers to as “millimeter wave” or “mmWave” technology. Using unlicensed spectrum around the 60GHz range in the United…
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Intel Activates Xeon Virtualization Tech
NEW YORK—Users with servers powered by Intel’s “Paxville” Xeon MP processor can now activate the chip’s virtualization capabilities. Speaking at a conference here on virtualization, Diane Bryant, vice president and general manager of Intel’s Server Platforms Group, said that users can now contact systems makers Dell, Hewlett-Packard and IBM to help them upgrade the BIOS…
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Microsoft Investigates HTML Help Flaw Warning
Microsoft’s security response team is investigating reports of a remotely exploitable buffer overflow in HTML Help Workshop, the standard help system for the Windows platform. The software vendor’s investigation follows the public release of a proof-of-concept exploit for the flaw, which is caused by a boundary error within the handling of a “.hhp” file. Security…
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IBM, Freescale Consolidate Power
IBM and Freescale Semiconductor aim to boost the Power processors architecture by aligning their chip design efforts. Senior executives at the two companies announced Feb. 6 an alliance under which they aim to create a common power architecture instruction set and align their chip road maps. Freescale will also join Power.org, the open Power processor…
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IBM Brings Power5+ to iSeries Servers
IBM is outfitting its line of System i5 servers with the new Power5+ processor and is introducing the newest version of its i5/OS operating system. The enhancements are designed to improve the performance and reach of the systems—which are targeted at SMBs (small and midsize businesses)—while upgrading the flexibility, security and disaster recovery capabilities in…
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HP Cools Down Data Centers
Hewlett-Packard is rolling out several technologies designed to cut cooling costs in the data center, including a water-filled module that fits over a new standard rack from the computer maker. HP’s Modular Cooling System is a self-contained unit that takes hot air from the back of the new HP 10000 G2 Series rack, cools it…
