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Energy management and automation provider Schneider Electric has introduced its portfolio of end-to-end liquid cooling solutions for hyperscale, colocation, and high-density data center environments. The company is positioning these offerings as critical enablers for the growth of future AI factories.
Cooling solutions for high-density AI chips
This marks the first major showcase of Schneider Electric’s liquid cooling capabilities since it acquired a controlling interest in Motivair, a specialist in liquid cooling and thermal management, in February 2025.
The portfolio features both liquid and air-cooled solutions built to meet the GPU-intensive demands of high-density data centers. It also addresses the thermal management requirements of next-gen high-performance computing (HPC), artificial intelligence, and accelerated computing workloads.
According to Schneider Electric, its comprehensive data center and liquid cooling portfolio is designed to address the hotter workloads that come from high-density AI chips. This includes all core cooling infrastructure as well as a robust supply chain needed to meet global demand.
The company emphasized that cooling alone can account for as much as 40 percent of a data center’s operating budget, making cooling a crucial investment to reduce costs and maximize efficiency.
“As data center cooling has grown more complex in the AI era, our portfolio has consistently evolved to remain capable of serving the infrastructure demands of today and tomorrow,” said Richard Whitmore, chief executive officer at Motivair by Schneider Electric.
“Today, we are the only liquid cooling provider to demonstrate proven expertise at the silicon level by co-developing our solutions in collaboration with NVIDIA, and other leading GPU manufacturers. In collaboration with Schneider Electric, we have created an unmatched portfolio that not only compresses time-to-market but increases ROI for customers worldwide,” Whitmore added.
Liquid cooling solutions for AI data centers
Motivair by Schneider Electric’s liquid and air-cooled solutions offer a broad range of data center physical infrastructure. This includes megawatt-class coolant distribution units (CDUs), rear door heat exchangers (RDHx), heat dissipation units (HDUs), and dynamic cold plates, among others.
Here’s an overview of the portfolio:
- CDUs: Motivair’s CDU family integrates seamlessly with next-gen processors and accelerators, scaling from 105 kilowatts to 2.5 megawatts. It’s also certified for NVIDIA’s latest hardware and equipped to handle increased rack densities well into the future.
- ChilledDoor® RDHxr: This rear-door heat exchanger cools rack densities up to 75 kW, making it ideal for power-intensive GPUs. Its rack-agnostic design also makes it a versatile solution for any HPC environment.
- Liquid-to-Air HDU: Delivers 100 kilowatts of heat rejection in a 600 millimeter footprint. It can also create a water loop to cool up to 132 kilowatts of cooling capacity—a 1:1 ratio with NVIDIA’s NVL144 computing architecture. Well-suited for AI accelerators, colocation environments, or labs where water is not readily available.
- Chillers and Technology Cooling System (TCS) Loops: Closed-loop, air-cooled chillers that save millions of gallons of water annually for every megawatt of cooling requirement, while maintaining high performance.
- Software: With over 50 years of expertise, Schneider Electric’s EcoStruxure software delivers optimal thermal management, performance, and efficiency for mission-critical environments.
- Services: Backed by a decade of field-proven cooling deployment and maintenance experience, with trained technicians available across all major regions.
Andrew Bradner, senior vice president of the cooling business at Schneider Electric, stated that the rise of AI has made liquid cooling “a strategic imperative” for data centers and AI factories. He highlighted the partnership with Motivair as a pivotal step in supporting this shift.
“By combining our multi-domain expertise with Motivair, we are charting a new frontier for accelerated computing with an unrivalled liquid cooling portfolio, featuring global scale, production, and reach, and a commitment to rigorously test and validate every solution we deliver to mitigate risk and deliver peace of mind for our customers,” Bradner said.
